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Abstract
Experimental work of the thermal performance of a variety of heat sinks with different base plates for enhancing heatdissipation rates in CPU have been undertaken. In this project work the fin thickness is varied from 3mm to 5mm and also the fin pitch is varied from 1.5mm to 3.5mm. The aluminum, copper and carbon carbon composite (ccc) materials are used as base plate of heat sink. The base plate thickness of 2.5mm and 5mm are used. Experimental results show that among the many design parameters, the base plate material ccc has the most significant influenceon the thermal performance of heat sinks. The thermal performance of the heat sinks is increased up to 42.3% by employing ccc base plate. The resultsalso show that heat sinks with copper base plate are superior to aluminum base. The best heat sink geometry is selected and modified in order to reduce maximum temperature distribution and hot spots of heat sink at center by varying fin pitch, fin thickness, base plate thickness and changing the base plate materials. In this study a complete computer chassis with different base plate heat sinks has been investigated. Although the performance of heat sink is good, the temperature of heat sink at center is high.